TXTHP-5023-2  Picosecond laser cutting machine

1. Product features

The ‘TXTHP-5023-2  laser glass cutting equipment developed and produced by our company is a professional laser precision processing equipment used in flat glass processing. It has a production efficiency several times higher than traditional glass processing methods, and the entire process is dry and dust-free. The environment can ensure the quality of the workpieces to be processed and avoid the possibility of secondary damage to the workpieces caused by cutting fluids, dust, etc. in traditional processing methods.

This equipment can give full play to the high-precision and high-speed characteristics of laser processing. Combined with the high-precision XY linear motor, it can achieve the high-speed and high-precision processing requirements for workpieces. The processing method is flexible, stable, and the yield rate is high. It can be adapted to various types of Different processing needs.

1.2. Equipment size, quality and usage environment

1.3. Main applications

This equipment is suitable for processing various types of optical glass, coated glass, ordinary glass, sapphire, quartz and other brittle materials.

(It is not recommended to use high-temperature splitting process for optical coating products)

2. Technical specifications

2.1. Processing principle

When an ultrafast laser beam propagates through a material, the beam can propagate over long distances in a dynamic balance between the two, forming micron-scale wire holes in the material. The linear motor controls the movement of the workpiece relative to the laser beam to generate numerous wires at equal distances. Holes, by optimizing the distance between wire holes, micro-cracks are generated along the direction of movement to achieve cutting.

The laser pulse width reaches the picosecond or femtosecond level, which can largely avoid the impact on the thermal motion of molecules. The ultrashort pulse generated by the picosecond ultrafast laser used in this equipment interacts with the material in a very short time and can be used quickly. The material in the processing area is vaporized and discharged without thermal impact on the surrounding materials. Therefore, ultra-fast optical processing is also called “cold processing”.

2.2. Laser source (cutting and splitting) module

The laser used in the cutting module of this equipment is an infrared picosecond pulse laser, which has high processing accuracy and fast processing speed to ensure stable output. The splitting module uses a CO2 laser, and the dual-platform design can achieve integrated cutting.

2.3. Laser source parameters

3. Application

As consumers pursue high quality products, suppliers are prompted to put forward higher requirements for the processing and manufacturing of brittle material products such as mobile phone screens, camera glass covers and screens, such as high cutting strength, small edge chipping, and good verticality. , high production efficiency, low cost, industry-leading technology and other high-tech and high-precision processing requirements. However, traditional CNC machining has contamination of the ring mirror by cutting fluid, low machining accuracy, small machining limit, wear of drills and other tools, and low machining efficiency. It requires more equipment, manpower and a larger site area, which directly leads to extremely high costs.

This equipment is developed based on the optimization and improvement of traditional processing methods and processes in terms of processing efficiency, processing accuracy, processing difficulty, and processing environment when processing precision optical components, and is dedicated to reducing daily production and operation costs for processing companies.